The rapid temperature change test chamber (stress screening test chamber ESS) is an instrument and equipment used to simulate the impact of different climate conditions on products, evaluate the reliability and durability of products. It is to examine the failure caused by the thermal mechanical properties of the product. When the materials that make up the various components of the product have poor thermal matching, or when the internal stress of the components is high, the temperature change test can cause the failure of the product caused by the deterioration of mechanical structural defects. Rapid temperature change testing is a powerful means of environmental stress screening, which can effectively eliminate early product failures.

Suitable for adaptability testing of various components such as aerospace products, instruments and meters, chemistry, materials, electrical engineering, electronic products, etc. under rapid or gradual temperature changes, or conducting stress screening tests, helping to scientifically analyze and evaluate the performance and changes of the test object under proposed conditions.

Test standard

• GJB1032 Environmental Stress Screening Method for Electronic Products
  GB/T2423.22-2002 Test Method for Temperature Changes
  IEC60068-2-1:2007 Low temperature test chamber test method
  IEC60068-2-2:2007 High temperature test chamber test method
  GB/T2423.3-2006 Test Method for Damp Heat Test Chamber
  GB/T2423.4-2008 Alternating Damp Heat Test Method
  IEC68-2-2 Test B: Dry heat
  GJB150.3 High Temperature Trial
  GJB150.4 Low temperature insurance test
  GJB150.9 Damp Heat Test
  ISO16750
  IPC-TM-650

Specifications

For more detailed parameters, please contact us!